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Public LEI record · Global LEI Index

Malaysia

ASSEMBLY PAYMENTS MALAYSIA SDN. BHD.

LEVEL 13, MENARA 1 SENTRUM 201, JALAN TUN SAMBANTHAN, BRICKFIELDS, KUALA LUMPUR, 50470, MY

Legal Entity Identifier 549300ZFFY4BYGZ1AX14
Entity status
Active
LEI status
Issued
Policy conformity
Conforming
Reference data
Partly verified
Next renewal
27 Oct 2027
LEI Issuer
London Stock Exchange

Record snapshot

The Legal Entity Identifier for ASSEMBLY PAYMENTS MALAYSIA SDN. BHD. is 549300ZFFY4BYGZ1AX14. It is valid, policy conforming and renewed until 27 Oct 2027.

ASSEMBLY PAYMENTS MALAYSIA SDN. BHD. is a Private Limited Company formed in Malaysia, registered as 202001040513 (1396834-X) with Corporate Registry, Malaysia. The LEI was registered on 1 Nov 2021. Some of its Level 1 reference data was confirmed against Corporate Registry, Malaysia at its last validation on 26 Oct 2026. The rest rests on what the entity supplied. It reports STANDARD CHARTERED PLC as its ultimate parent. London Stock Exchange maintains the record.

351 Days left in this cycle
Transfer to RapidLEI A transfer changes which LEI Issuer manages the record. The LEI code and its reference data do not change.

Record lifecycle

Five successful renewals, no break in 5 years.

First LEI registered on 1 Nov 2021, with at least 5 renewals recorded. The next renewal falls due on 27 Oct 2027, which is 12 months from today.

1 Nov 2021 LEI issued Five renewal marks Each mark is a renewal that completed 27 Oct 2027 Next renewal due

Registered entity Level 1 data

Legal name
ASSEMBLY PAYMENTS MALAYSIA SDN. BHD.Registered in Malay
Legal form
Private Limited Company XEOV
Jurisdiction
Malaysia MY
Registration
Registered at Corporate Registry, Malaysia RA000439. Registration number 202001040513 (1396834-X)
Entity created
29 Oct 2021
Legal address
LEVEL 13, MENARA 1 SENTRUM 201, JALAN TUN SAMBANTHAN, BRICKFIELDS, KUALA LUMPUR, 50470, MY
Connected identifiers
QCCQMY4BFWKEN S&P Capital IQ1686922478 Other identifiers recorded against this LEI.
Securities
Not recorded No ISIN is mapped to this LEI in the ANNA and GLEIF ISIN-to-LEI file. That records the absence of a mapping, not the absence of securities.

What this record’s status means

Reference data
Partly verified GLEIF records this as partially corroborated. Some fields were checked against Corporate Registry. The remainder is based on information the entity supplied.

Changes to this record

  1. Renewed. The next renewal date moved from 27 Oct 2026 to 27 Oct 2027.

Show 26 earlier changes

  1. Renewed. The next renewal date moved from 27 Oct 2025 to 27 Oct 2026.

  2. The legal address was updated.

  3. The headquarters address was updated.

  4. Corporate event recorded: Change legal address.

  5. Renewed. The next renewal date moved from 27 Oct 2024 to 27 Oct 2025.

  6. Renewed. The next renewal date moved from 27 Oct 2023 to 27 Oct 2024.

  7. Registration status changed from Pending archival to Issued.

  8. Renewed. The next renewal date is now 27 Oct 2023.

  9. Management of this LEI transferred from GMEI Utility a service of BED B.V. to London Stock Exchange.

  10. The legal address was updated.

  11. The headquarters address was updated.

  12. Registration status changed from Pending transfer to Pending archival.

  13. Registration status changed from Issued to Pending transfer.

  14. The legal address was updated.

  15. The headquarters address was updated.

  16. The legal address was updated.

  17. The headquarters address was updated.

  18. The legal address was updated.

  19. The headquarters address was updated.

  20. The legal address was updated.

  21. The headquarters address was updated.

  22. The legal address was updated.

  23. The headquarters address was updated.

  24. Renewed. The next renewal date moved from 5 Nov 2022 to 27 Oct 2023.

  25. The next renewal date moved from 29 Oct 2022 to 5 Nov 2022.

  26. The LEI was registered and first published to the Global LEI Index.

Ownership Level 2 data

  1. Ultimate parent

    STANDARD CHARTERED PLC

    GB · U4LOSYZ7YG4W3S5F2G91

    Active

  2. Direct parent

    ASSEMBLY PAYMENTS PTE. LTD.

    SG · 5493008W0KUEW1VX6696

    Active

  3. This entity

    ASSEMBLY PAYMENTS MALAYSIA SDN. BHD.

    MY · 549300ZFFY4BYGZ1AX14

    Active

  4. Below
    0 Direct subsidiaries
    0 Ultimate subsidiaries

    The chain ends here. No other entity reports ASSEMBLY PAYMENTS MALAYSIA SDN. BHD. as its parent, so the count is a stated zero rather than data still to arrive.

Level 2 data records who consolidates this entity. A reported relationship, or a reported reason for the absence of one, both satisfy the standard. Only a record carrying neither is incomplete.

Where this data comes from

Source registry

Corporate Registry, Malaysia

Validated against

Corporate Registry, Malaysia

Maintained by

London Stock Exchange

Published in

The GLEIF Global LEI Index. This record last updated 26 Oct 2026

ASSEMBLY PAYMENTS MALAYSIA SDN. BHD.

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How to use this

Reference data from the GLEIF Global LEI Index, as published on 26 Oct 2026.