Public LEI record · Global LEI Index

Malaysia

ARROW COMPONENTS (M) SDN. BHD.

Unit 30-01, Level 30, Tower A,, Vertical Business Suite, Avenue 3, Bangsar South, No.8, Jalan Kerinchi, KUALA LUMPUR, 59200, MY

Legal Entity Identifier 549300NFF04VSZKWL441
Entity status
Active
LEI status
Issued
Policy conformity
Non-conforming
Reference data
Register-verified
Next renewal
21 Feb 2027
LEI Issuer
Bloomberg

Record snapshot

The Legal Entity Identifier for ARROW COMPONENTS (M) SDN. BHD. is 549300NFF04VSZKWL441. It is valid and renewed until 21 Feb 2027.

ARROW COMPONENTS (M) SDN. BHD. is a Private Limited Company formed in Malaysia, registered as 199001011536 (748695-A) with Corporate Registry, Malaysia. The LEI was registered on 12 Oct 2013. At its last validation on 17 Feb 2026, all of its Level 1 reference data was confirmed against Corporate Registry, Malaysia. It reports ARROW ELECTRONICS, INC. as its ultimate parent. Bloomberg maintains the record.

The Policy Conformity Flag is not set, which means the ownership data GLEIF requires, known as Level 2 relationship data, is missing or out of date. The LEI itself remains valid, and the flag clears once the outstanding item is resolved. If this is your LEI, contact your LEI Issuer for assistance.

124 Days left in this cycle
Transfer to RapidLEI A transfer changes which LEI Issuer manages the record. The LEI code and its reference data do not change.

Record lifecycle

Five successful renewals in 13 years.

First LEI registered on 12 Oct 2013, with at least 5 renewals recorded. The next renewal falls due on 21 Feb 2027, which is 4 months from today.

12 Oct 2013 LEI issued Five renewal marks Each mark is a renewal that completed 21 Feb 2027 Next renewal due

Registered entity Level 1 data

Legal name
ARROW COMPONENTS (M) SDN. BHD.Registered in Malay
Legal form
Private Limited Company XEOV
Jurisdiction
Malaysia MY
Registration
Registered at Corporate Registry, Malaysia RA000439. Registration number 199001011536 (748695-A)
Entity created
22 Aug 1990
Legal address
Unit 30-01, Level 30, Tower A,, Vertical Business Suite, Avenue 3, Bangsar South, No.8, Jalan Kerinchi, KUALA LUMPUR, 59200, MY
Connected identifiers
QCCQMYU8GDE1S S&P Capital IQ24687249 Other identifiers recorded against this LEI.
Securities
Not recorded No ISIN is mapped to this LEI in the ANNA and GLEIF ISIN-to-LEI file. That records the absence of a mapping, not the absence of securities.

What this record’s status means

Reference data
Register-verified GLEIF records this as fully corroborated. At its last validation, all of the entity's Level 1 reference data was verified against an authoritative public source.
Policy conformity
Non-conforming The parent that consolidates this entity does not hold an LEI. The flag clears when it obtains one.

Changes to this record

  1. The legal address was updated.

Show 31 earlier changes
  1. The headquarters address was updated.

  2. Renewed. The next renewal date moved from 21 Feb 2026 to 21 Feb 2027.

  3. The legal address was updated.

  4. Legal form changed from Public Limited Company to XEOV.

  5. Registration status changed from Lapsed to Issued.

  6. Renewed. The next renewal date moved from 16 Feb 2025 to 21 Feb 2026.

  7. Registration status changed from Issued to Lapsed.

  8. Registration status changed from Pending archival to Issued.

  9. Renewed. The next renewal date moved from 19 Oct 2023 to 16 Feb 2025.

  10. Management of this LEI transferred from London Stock Exchange to Bloomberg.

  11. Registration status changed from Pending transfer to Pending archival.

  12. Registration status changed from Lapsed to Pending transfer.

  13. Registration status changed from Issued to Lapsed.

  14. Registration status changed from Pending archival to Issued.

  15. Renewed. The next renewal date is now 19 Oct 2023.

  16. Management of this LEI transferred from GMEI Utility a service of BED B.V. to London Stock Exchange.

  17. The legal address was updated.

  18. The headquarters address was updated.

  19. Registration status changed from Pending transfer to Pending archival.

  20. Registration status changed from Issued to Pending transfer.

  21. Renewed. The next renewal date moved from 29 Oct 2022 to 19 Oct 2023.

  22. Legal name changed from Arrow Components (M) Sdn. Bhd. to ARROW COMPONENTS (M) SDN. BHD..

  23. Registration status changed from Lapsed to Issued.

  24. Renewed. The next renewal date moved from 5 Oct 2016 to 29 Oct 2022.

  25. Legal form changed.

  26. Legal form changed from No separate legal form to Public Limited Company.

  27. Legal jurisdiction recorded as Malaysia.

  28. Legal jurisdiction changed.

  29. Legal form changed from Legal form not yet on the ELF code list to No separate legal form.

  30. Renewed. The next renewal date is now 5 Oct 2016.

  31. The LEI was registered and first published to the Global LEI Index.

Ownership Level 2 data

  1. Ultimate parent
  2. Direct parent
    Parent has no LEI Reported exception Parent exists, not LEI-identified
  3. This entity

    ARROW COMPONENTS (M) SDN. BHD.

    MY · 549300NFF04VSZKWL441

    Active

  4. Below
    0 Direct subsidiaries
    0 Ultimate subsidiaries

    The chain ends here. No other entity reports ARROW COMPONENTS (M) SDN. BHD. as its parent, so the count is a stated zero rather than data still to arrive.

Level 2 data records who consolidates this entity. A reported relationship, or a reported reason for the absence of one, both satisfy the standard. Only a record carrying neither is incomplete.

Where this data comes from

Source registry

Corporate Registry, Malaysia

Validated against

Corporate Registry, Malaysia

Maintained by

Bloomberg

Published in

The GLEIF Global LEI Index. This record last updated 17 Feb 2026

ARROW COMPONENTS (M) SDN. BHD.

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How to use this

Reference data from the GLEIF Global LEI Index, as published on 17 Feb 2026.