Public LEI record · Global LEI Index Managed by RapidLEI
Singapore
77 ROBINSON ROAD, #16-00, ROBINSON 77, Singapore, 068896, SG
Record snapshot
The Legal Entity Identifier for RIPPLE MARKETS APAC PTE. LTD. is 98450060F9F56F87ED90. It is valid, policy conforming and renewed until 1 May 2027.
RIPPLE MARKETS APAC PTE. LTD. is a Private Company Limited by Shares formed in Singapore, registered as 202012084E with Business Registry, Singapore. The LEI was registered on 1 May 2024 and has been renewed 2 times since. At its last validation on 26 Mar 2026, all of its Level 1 reference data was confirmed against Business Registry, Singapore. It reports no parent, on the grounds that no parent prepares consolidated accounts that include it. RapidLEI maintains the record.
Two successful renewals, no break in 3 years.
First LEI registered on 1 May 2024 and has been maintained for 3 years with 2 renewals recorded. The next renewal falls due on 1 May 2027, which is 6 months from today.
IWZFSGRA000523. Registration number 202012084E QSG9BXGSUF
S&P Capital IQ1880154419
Other identifiers recorded against this LEI.
What this record’s status means
Legal form changed from LWXI to IWZF.
A legal address was recorded.
A headquarters address was recorded.
Renewed. The next renewal date moved from 1 May 2026 to 1 May 2027.
Renewed. The next renewal date moved from 1 May 2025 to 1 May 2026.
The LEI was registered and first published to the Global LEI Index.
RIPPLE MARKETS APAC PTE. LTD.
Active
The chain ends here. No other entity reports RIPPLE MARKETS APAC PTE. LTD. as its parent, so the count is a stated zero rather than data still to arrive.
Level 2 data records who consolidates this entity. A reported relationship, or a reported reason for the absence of one, both satisfy the standard. Only a record carrying neither is incomplete.
Source registry
Business Registry, Singapore
Validated against
Business Registry, Singapore
Maintained by
Ubisecure RapidLEI
Published in
The GLEIF Global LEI Index. This record last updated 26 Mar 2026
Reference data from the GLEIF Global LEI Index, as published on 26 Mar 2026.